ACE 1 Litre No Clean Flux 0% Soldering Liquid Flux
ACE 1 Litre No Clean Flux 0% Soldering Liquid Flux
ACE 1 Litre No Clean Flux 0% Soldering Liquid Flux has been d esigned for use in the electronic industry to improve effectiveness in dip and wave soldering of conventional PCB assemblies. Process Considerations:- The flux needs to be pre-heated post application in order to activate it. Recommended t
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- The flux needs to be pre-heated post application in order to activate it.
- Recommended temperature may be anywhere between 90˚C to 150˚C (194˚F to 302˚F) depending upon circuit board design, board thickness, length of contact time with molten solder, speed of solder flow and preheating time.
- Solder pot temperature should be set between 245- 260˚C (473-500˚F) for Sn63Pb37/Sn60Pb40 alloy and between 260-270˚C (500-518˚F) for SnCu/SnAgCu alloys.
- Please note that the above are only guidelines and the optimum settings for a given assembly may vary keeping in mind the above mentioned factors.
- Flux residues are non-corrosive and non-conductive, thus do not require removal in most applications. In case residue removal is required our PCB Cleaner may be used for the same.
- It is flammable, thus must be stored in a cool and dry place away from all sources of ignition. Shelf life is indefinite at room temperature when stored properly.
- Application may be done manually using a brush or via spraying.
- Specific Gravity: 0.82±0.005
- Percent solids (theoretical): 1.5
- State: Liquid
- Acid number: 35.0mg KOH/g
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ACE 1 Litre No Clean Flux 0% Soldering Liquid Flux has been d esigned for use in the electronic industry to improve effectiveness in dip and wave soldering of conventional PCB assemblies. Process Considerations:- The flux needs to be pre-heated post application in order to activate it. Recommended temperature may be anywhere between 90˚C to 150˚C (194˚F to 302˚F) depending upon circuit board design, board thickness, length of contact time with molten solder, speed of solder flow and preheating time. Solder pot temperature should be set between 245- 260˚C (473-500˚F) for Sn63Pb37/Sn60Pb40 alloy and between 260-270˚C (500-518˚F) for SnCu/SnAgCu alloys. Please note that the above are only guidelines and the optimum settings for a given assembly may vary keeping in mind the above mentioned factors. Cleaning:- Flux residues are non-corrosive and non-conductive, thus do not require removal in most applications. In case residue removal is required our PCB Cleaner may be used for the same. Storage and Shelf Life:- It is flammable, thus must be stored in a cool and dry place away from all sources of ignition. Shelf life is indefinite at room temperature when stored properly. Applications : Application may be done manually using a brush or via spraying. Specifications : Specific Gravity: 0.82±0.005 Percent solids (theoretical): 1.5 State: Liquid Acid number: 35.0mg KOH/g Package Includes : 1 x ACE 1 Litre No Clean Flux 0% Soldering Liquid Flux
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ACE 1 Litre No Clean Flux 0% Soldering Liquid Flux